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Know About the Basic Details of Flip Chip Technology
Flip Chip connections have shorter interconnect lengths compared to wire bonding, reducing parasitic capacitance and inductance, which leads to better electrical performance, higher speed, and lower power consumption. Flip Chip technology allows for higher packaging density since the connections are made directly between the silicon die and the substrate, rather than using bonding wires. This enables more components to be packed into a smaller area, making it suitable for high-density integrated circuits. Flip Chip connections provide better thermal performance due to the direct connection between the die and the substrate, which facilitates more efficient heat dissipation. This is especially important for high-performance and high-power applications. Contact info:- https://efpcb.wordpress.com/2024/04/24/know-about-the-basic-details-of-flip-chip-technology/
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Target State: All States Target City : Guangdong Last Update : 04 May 2024 4:21 PM Number of Views: 46	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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INNetAds > Business Opportunities > Other Business Ads > Item ID 1629355

2024-05-05 (0.582 sec)